Introduction This application note describes the recommended procedure for removing a leadframe chip scale package (LFCSP) from a printed circuit board (PCB). LFCSP complies with JEDEC MO-220 and MO-229 form factors. This application note complements
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I believe that the fruit fans who have continued to pay attention to Mingmei Infinite should all know that the iPhone 12 launched by Apple last year has been enthusiastically sought after by consumers around
Continue readingTo ease the global chip supply crisis, the European Union may ease restrictions on state aid to the semiconductor industry. The European Commission is likely to agree on a new state aid policy at a
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